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SOFNG SNO-019

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SOFNG SNO-019

Description : Card Connector NANO SIM Tray Surface Mount

Card Connection Mode : Tray

Card Detection : No Card Detect

Operating Temperature : -25℃~+75℃

Delivery Time : 3-9工作日

Model Number : SNO-019

MOQ : 50

Connector Type : Connector and Ejector

Stock : 2000

Brand Name : SNO-019

Height Above Board : 1.5mm

Packaging Details : SMD

Card Type : Nano-SIM Card

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Product Overview

The SOFNG SNO-019 is a NANO SIM card holder designed for SMT (Surface Mount Technology) applications. Featuring a push-push lever mechanism, it offers a reliable and stable connection with a tin-based gold plating for enhanced durability (24H salt spray resistance). The housing is constructed from high-temperature resistant plastic, making it suitable for demanding electronic assemblies. This product is RoHS compliant, indicating it is an environmentally friendly, lead-free product.

Product Attributes

Brand: SOFNG
Model: SNO-019
Product Name: NANO SIM Card Holder / SMT
Type: PUSH-PUSH Type
Material: Contact: Copper Alloy (G/F) with 0.1m Ni Plated Overall; Housing: Thermoplastic UL 94V-0, Color: Black; Shell: Stainless SUS304 (G/F), Gold Plating; Lever: Stainless SUS304 (G/F), No Plating; Hinge: Stainless SUS304 (G/F), No Plating.
Plating: Tin-based gold plating (24H Salt Spray)
Certifications: RoHS (Lead-free)
Origin: DONGGUAN SOFNG ELECTRONIC TECHNOLOGY Co., LTD

Technical Specifications

Specification	Details
Model Number	SNO-019
Product Name	NANO SIM Card Holder / SMT
Product Classification	SPECIFICATION
Product Size	L-16.5mm W-15.9mm H-1.5mm (with card tray)
Product Features	Push Lever (Thimble Type) NANO-SIM Card Holder; Reliable, Tin-based Gold Plating (Salt Spray 24H), High-temperature resistant plastic.
Mounting Type	Surface Mount Technology (SMT)
Insertion Direction	Lateral
SIM Card Pin Assignment	Pin 1 (C1): VCC Pin 2 (C2): RST Pin 3 (C3): CLK Pin 4 (C4): Reserved Pin 5 (C5): GND Pin 6 (C6): VPP Pin 7 (C7): I/O Pin 8 (C8): Reserved
Electrical Properties (Initial)	Contact Resistance: 30m max.
Electrical Properties (Withstand Voltage)	300V AC for 1min
Durable Performance (No Load)	8,000 Cycles
Durable Performance (Rated Load)	6,500 Cycles
Insertion Force	4.0Kgf MAX
Performance Requirements (Temperature Rise)	30C Max. (Carry rated current load: 0.3A per contact)
Performance Requirements (Vibration)	No electrical discontinuity greater than 1 sec (s) shall occur. Contact resistance: 100 m max.
Performance Requirements (Shock)	No electrical discontinuity greater than 1 sec (s) shall occur. No damage to product.
Performance Requirements (Thermal Shock)	No damage. Contact Resistance (Low Level) (Final): 100 m max. (Temperature range: -55C to +85C)
Performance Requirements (Humidity)	No damage. Contact Resistance (Low Level) (Final): 100 m max. Dielectric Strength: OK. Insulation Resistance: 100 M min. (Temperature: 402C, 96 hours; Relative humidity: 90-95%)
Performance Requirements (Solderability)	Appearance inspection after test. Soldering time: 3 to 5 Seconds; Temperature: 2555C.
Performance Requirements (Resistance to Soldering Heat)	No damage. (Subject product to 2555C chamber for 2 minutes)
Performance Requirements (Salt Spray)	Contact Resistance (Low Level) (Final): 100 m max. (51% salt concentration, 244 hours, 352C)
Performance Requirements (High Temperature)	Contact resistance: 100 m max. (Subject product to 852C for 96 hours continuously)
Performance Requirements (Low Temperature)	Contact resistance: 100 m max. (Subject product to -255C for 96 hours continuously)

Usage Precautions

Avoid using water-soluble flux as it may cause corrosion.
When soldering terminals, avoid applying pressure to the product to prevent displacement, deformation, or degradation of electrical characteristics.
For double soldering, allow the product to return to room temperature after the first soldering. Continuous heating can cause plastic deformation/aging, terminal loosening/disconnection, and reduced electrical characteristics.
Prevent flux from infiltrating the product to avoid damage, contact failure, or malfunction.
Refer to the product diagram for recommended dimensions for printed circuit boards and mounting hole patterns.
During the overall assembly process, do not apply external force to the product.
When used under low voltage conditions (below DC1V), poor contact may occur. This product is designed for DC resistance loads and should not be used with other loads (inductive loads, capacitive loads).
Applying excessive operating force during use or testing may damage the product.
Store in a cool, dry place at room temperature (25C, within 50% humidity), away from direct sunlight and corrosive gases. Use within 6 months from the date of delivery.

Disposal Information

Products do not belong to hazardous waste. When waste, it can be entrusted to a recycler for recycling and processing.

Transportation Precautions

During transportation, avoid direct contact with water, acidic or alkaline chemicals, or exposure to environments containing such gases. Be mindful of the risk of falling or tipping over. Avoid collisions or squeezing during transit. Maintain moderate temperature and humidity (room temperature 25C, within 50% humidity) to prevent material deformation or oxidation.

Welding Conditions

Hand Soldering

Soldering Iron: 350C max., 3s max., 60W max.
Immersion Soldering: 260C max., 5s max.

Reflow Soldering (for SMT products)

Heating Method: Far-infrared upper and lower heating.
Temperature Measurement: Use 0.1~0.2 CA(K) or CC(T) to measure at the solder joint (tin/copper foil surface).
Fixing Method: Use heat-resistant tape.
Temperature Distribution:
- Preheating: 150-180C, 120 sec max.
- Peak Temperature: 260C max., 3 sec max.
- Cooling: 3 to 4 min.

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